Especially designed for LEAD FREE Soldering

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X-Reflow306 LF  X-Reflow306 LF-AC

High performance, low-cost reflow batch oven for use in small lot production and laboratory simulation tests.

The X-Reflow306 was designed for prototyping, laboratory testing, heat-resistance testing and low volume production.

FEATURES

The unit has several unique features:

  • Full convection heating with independent control of the front and rear heaters, which enables hot air temperature and time settings in 5 zones and pre-setting of various profiles for different PCB’s.
  • The large inspection window allows for monitoring the soldering process during operation (inspection can also be done using a microscope or camera system). Microprocessor-based control uses closed-loop monitoring to ensure absolute repeatability of the temperature profiles and has enough memory to store 250 profiles.
  • The large backlit display shows either the specific temperatures and times or a graph of temperature versus time in real time. The Nitrogen Gas inlet is standard and the oven can be used for soldering in a nitrogen environment without requiring any additional hardware.
  • The unit has a computer interface for downloading firmware upgrades. This also will enable future custom settings to be downloaded from a PC via the X485-USB Converter.
  • The minimum temperature setting is 50°C to accommodate soldering or curing conductive adhesives and other materials that need lower temperatures.
  • The PC interface will allow for use of our Windows-based PC Control Program for programming and operating the oven as well as recording the executed profiles on the PC. The schedule for the release of this program is Feb 2020.
  • At present two external thermocouple inputs located on the back panel in conjunction with the optional X-306 Oven Monitor program allow operator to monitor (see the temperature in real time on a PC, save the graph and print it) the board temperature throughout the entire reflow process when using the optional X-306 Oven Monitor program.
  • HIGH OPERATING TEMPERATURE for LEAD FREE SOLDERING
    The operating temperature of 350°C (662°F), which is higher than other ovens, and better materials ensure performance when soldering with lead free alloys.
  • HIGH PERFORMANCE
    The X-Reflow306 LF is a low-cost, high-performance production reflow batch oven. This unit has several unique features.
  • SMALL DESKTOP SIZE
    It has a small footprint and weighs only 43kg. Conventional ovens are large in size, but the X-Reflow306 LF can fit on top of a desk in a small room.
  • LARGE GLASS VIEWING WINDOW
    The large glass viewing window (280x280mm for the X-Reflow306 LF and 200x200mm for the X-Reflow306 LF-AC) allows for viewing the inside of the heating chamber and observing the heated object. Users can see and check or photograph the details of a soldering process by using a microscope or camera.
  • LARGE BACKLIT LCD DISPLAY WITH DIGITAL PROGRAM AND GRAPHIC PROFILE INFORMATION
    The large backlit LCD display allows easy program entry and verification. Pressing one key can change the temperature numeric profile into a graph display to allow easy checking of the operating conditions at a glance. Depending on the working area, the LCD display brightness can be adjusted by the contrast adjustment in the settings menu.
  • CAPACITY TO STORE UP TO 250 PROGRAMS
    The oven has five operation zones- preheat 1, preheat 2, Soak, Reflow and Cooling. Each zone has defined a desired temperature and the time in which to reach and maintain this temperature. There is an additional purging zone when soldering in inert gas environment. Up to 250 such programs can be stored in the unit’s memory and recalled when needed.
    Each Program can be specific to the PCB size and construction (number of layers), type of solder paste used for the process, mounting density, component size and mass etc.
  • INDEPENDENT CONTROL OF THE FRONT AND REAR HEATERS
    If the thermal load on the board is not distributed symmetrically, the operator can independently control the temperature of the front and back heaters.
  • TIME ZONE LED (Operation LEDs)
    The profile drawing and current zone LEDs on the front panel allow progress to be checked at a glance.
  • N2 PORT
    To decrease the oxidation of leads, pads, and the solder during soldering, a compressed N2 gas source can be connected to the oven to replace the air (oxygen).
  • MANAGEMENT CONTROL OF THE PRE-PROGRAMMED PROFILES
    The oven has password protection. This allows for enabling/disabling programming of the profiles and entering changes to them.
  • SEQUENCER MODE (Another UNIQUE Feature)
    For manufacturers of laminates who make PCBs which have to temperature cycle samples of the material (This means bringing the material to a required temperature following a recommended profile and then cooling it to room temperature) several times, the X-Reflow306 LF-AC has a special mode of operation called SEQUENCER. In this mode, the operator can pre-program a sequence of up to eight Programs and the low-end temperature to which the board needs to be cooled to. The oven will execute the sequence semi-automatically. It will run the first program, vent the fumes from the oven, prompt the operator to lift the clamshell top, cool the heated specimen to the pre-programmed temperature and prompt the Operator to close the clamshell top and press ENTER to start the next cycle.
  • INTERFACE with a PC
    The unit is equipped with an interface to a PC (connection to a PC via an XKAR X485-USB converter) to enable firmware upgrades, use of the X-KAR Oven Monitor program to see and document the real temperature on the processed PCB, and, in the future, control the oven from a PC.
  • ACCELERATED, ADVANCED COOLING SYSTEM (X-Reflow306 LF-AC model only)
    The Advanced Cooling System in the X-Reflow306 LF-AC model, when connected to a pressurized air source (known as shop air) cools the soldered PCB's at a much quicker rate than is possible in regular ovens. This provides better reliability of soldering connections and better safety for the Operators handling the boards.
  • INTELLIGENT AND UNIQUE FUME EXTRACTION MANAGEMENT
    Each X-Reflow306 LF, like no other oven in the industry, is equipped with the Proprietary Fumes Cooling System and a program-controlled power outlet for the fume extractor. This makes it possible to connect and start the Fume Extractor at the end of the Reflow Zone when the oven is still closed and extract the fumes before the oven is opened. The timing of when it starts and how long the fume extractor will work is controlled by the oven administrator who can control this in the settings MENU. This way the fumes do not mix with air in the room and can be extracted through a HEPA-type high vacuum fume extractor. (The X-KAR Brand offers X-306 FumeExtract for this purpose). 

Technical Specifications

 

X-Reflow306 LF and X-Reflow306 LF-AC

Reflow area

12"x12"x1.75" (305x305x45 mm)

Temperature range

50°C to 350°C

Temperature Zones

Preheat1, Preheat2, Soak, Reflow, Cooling – Total of 5 (five) zones

Heaters

2 Heaters (Front and Rear) 3.45kW (230V) and 3.45KW (280V) - Please specify the voltage to receive the correct heaters. The heaters are programmed independently

Max. PCB size

12"x12" (305x305 mm)

Supply Requirements

30 amps, 230V 50/60 Hz (Max power consumption: 6.9 kW)

Cooling Cycle

Last (Fifth) Zone

Monitoring Window Size

9.84"x9.84" (280×280 mm) From 2020, the window size for all models will be 200mm x 200mm

Nitrogen Connection

Standard Connector. Nitrogen pressure:1/2-1bar (7-14.5 psi)

Size

L=30"xW=20"xH=12" (L=480mm x W=711mm x H=200mm)

Weight (unpacked)

88 lbs. (40 kg)

Computer profile control       

Allows pre-programming, storage and recall of up to 250 programs

Communication with PC

RS485 port (XKAR X485-USB converter required to connect to PC USB port)

Advanced Features

Display of the actual temperature/time numerically or as a graph,
Independent offset for the heaters,
RS-485 port for downloading firmware upgrades from a PC,
Ready to solder in Nitrogen environment,
Variety of ways to monitor process in progress




X-Reflow306 LF ManualX-Reflow306 LF-AC Manual

List of Errors displayed by X-Reflow306 OvensX-Reflow306 LF-AC (More Info)

Additional Features:

X-306 Oven Monitor

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Process Monitoring Software that displays the graphs of temperature versus time on a PC or laptop. It reads the front and rear thermocouples in the oven and two additional thermocouples connected by the oven operator. To see, record, and save or print the profile of the soldered PCB, one or two external "K" thermocouples can be connected to the board or one to the board and another inside the oven above the board to see the actual board and air temperatures during the program cycle.

X-306 Fume Extract

For X-Reflow306 LF only

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High Vacuum Fume Extraction Unit with HEPA Filtration for Batch Oven X-Reflow306. Powered from the back panel of the X-Reflow306 LF and X-Reflow306 LF-AC units. Because Batch ovens are usually used in smaller rooms it is a must, to extract and clean the fumes generated during soldering.

MANUAL- X-306 FumeXtract

X-306A Fume Extract

For X-Reflow306 LF-AC and X-Reflow306/S only

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Powered from the back panel of the ovens. Because these Batch ovens are cooled by pressurized air or nitrogen, the cooling gas  pushes hot air out of the oven into the filtration unit. Hot gas passes through the heat exchanger and, after it is cooled, enters the HEPA filter and is released into the room through the round opening on the bottom of the filtration unit. The user can attach the hose to route the clean air outside of the room if needed.

MANUAL- X-306A FumeXtract